Project/prototyping boards

Solderable Breadboards and project boards

I offer a line of prototyping boards inspired by the traditional “solderable breadboard” type prototyping board. These boards provide large numbers of holes on a 0.1” grid, combined in groups of 2, 3, or 4 (much like the holes in a breadboard) with exposed copper between the holes. These are convenient for use with DIP packages, and almost any other through-hole package available, Ground is routed around the board on an exposed trace with many holes along it’s length, ensuring that no matter where on the board you’re working, there is always a ground nearby. On many boards, the same is done for a second power rail, marked Vcc.

These project prototyping boards are available for purchase on Tindie: https://www.tindie.com/stores/DrAzzy/ .

Surface Mount made easy

Nowadays, almost all new commercial designs use surface mount devices (SMDs). Manufacturers now produce many of their newest and most exciting parts only in surface mount. Many hobbyists have long shied away from working with SMD parts. Not only is surface mount soldering more challenging than through-hole (though it is much easier than many imagine it to be) but short of fabricating a custom board, it typically requires mounting each part in your design on a separate breakout board, and then wiring those together, often ending up in a tangled mess. No longer - almost all of my project boards include pads for surface mount components, broken out to rows of the same kind of easily-soldered holes as the through-hole prototyping area. Now, you can mix and match exciting new surface mount components with traditional DIP parts on the same board! Boards are available with support for SOIC, (T)SSOP, DFN, SOT-23, TO-89, MSOP, and those 5050 PLCC packages used for RGB LEDs. To maximize versatility, most of these boards feature two different footprints connected to a given row of holes. A unique combined footprint accommodates SOT-23-6 and 5050 PLCC.

Premium production quality

I don’t take half-measures in my products. Unlike some similar boards, these are produced to the same quality standards as a production board. All are double-sided, with plated through holes - you can put components on whichever side makes more sense. They have silk-screened markings where appropriate and vibrant solder mask, with HASL (Hot Air Solder Leveling) surface treatment (which leaves the copper pre-tinned) with lead-free solder.

Microcontroller project boards

I sell a number of what I call "project boards", which are specifically optimized for a given microcontroller - these have a set of holes and/or pads on which to mount the microcontroller; each pin on the MCU is connected to a row of holes. For the ATtiny x4 and x5 series, the chip is installed directly on the board. Larger project boards are also available for the Arduino Pro Mini (and most clones thereof) and the Espruino Pico. For these cases, the small board with the microcontroller and supporting circuitry can be mounted either on 0.1” pin header, or directly on the surface of the board.

Power supply section

Many of the larger boards feature a power supply section, consisting of holes for a 2.1mm barrel jack or similar, connected to pads for one (or more) SOT-223 voltage regulator(s). The outputs are connected to a groups of pins marked “VOut”. Where there is a regulator on both sides of the board, they will be marked “VOut(T)” for the top regulator, and “VOut(B)” for the one on the bottom.

Espruino Pico project board - AZP-1E

$4.25

Turn your Espruino Pico ( Javascript for Things ) into a 4" by 4" prototyping playground! This board provides pads for the most popular surface mount packages, broken out to rows of 0.1" pin headers for ease of connection. Each pin goes to two or three holes, so making multiple connections to a pin is easy. At the top, a row of 8 pads that can take either an SOT-23-6 part (such as the MAX1555 LiPo charger IC, or some small EEPROMs, or even buck/boost controllers), or the 5050 package commonly used for RGB-LEDs, including the WS2812/B. On the back of the board, these pins go to pads for three SOIC-16 packages (you can put two SOIC-8's next to each other as well). To the right of that are two banks of pads for SOT-23 MOSFETs. Each bank of 4 FETs is connected to a common source, and pads are provided for a resistor between source and gate. A barrel jack, and optionally voltage regulators (in SOT-223 and SOIC-23-5 package) can be added to supply power. The popular ESP8266 WiFi module can be easily used with the pads in the lower right corner. These are for the Wi7-7 and Wi7-12 package, (from Electrodragon and others), and pads are provided for a capacitor across the power supply, which may be necessary for reliable operation. (Of course, you can also use the Wi7C-1 with the 8 pins in the through-hole prototyping area). These same pads are the same spacing as used in the HopeRF RF transceiver modules and many others. The spacing is also the same as used in 1W RGB/RGBW LEDs. While the LED would rapidly overheat at full power, this might be useful at a lower duty cycle, or for brief flashes. In this case, the SOT-89 pads on the underside can be used for AMC7135 current regulators for the LEDs.

Features

  • Three ways to mount a Pico
    • On castellated pads, with the USB connector hanging over the edge
    • On pin header, with the USB connector hanging over the edge
    • On pin header, using the second set of pins, with the USB connector flush with the edge of the board.
  • Row of 8 SOT-23-6/5050 pads on front, 3 SOIC16 pads on back
  • Two sets of pads for 4 SOT-23 MOSFET w/pads for resistor between gate and source
  • Two rows of 8 pins in 0.1", 2mm, and 0.05" pitch
  • Set of 2 SOIC24W/N and one MSOP-12 (0.65mm pitch on front, 0.5mm on back*) or DFN-12 pads on front, two SSOP-28 on back
  • MSOP-12 (0.5mm)* has exposed pad, for use with WSON-12 packages (note that there is not enough copper around this pad to function as a heatsink - so an external heatsink may be necessary depending on part and operating conditions)
  • Multiple smaller SOIC or SSOP parts can be placed in one of the larger footprints
  • Four wire signal bus runs the length of this section - ideal for working with multiple I2C or SPI devices
  • Power supply section with holes for barrel jack (center positive)
  • Pads for three voltage regulators in standard pinouts (two TO-223, one SOT-23-5) and associated caps
  • Exposed, uncommitted GND and Vcc traces for easy power and ground wiring
  • Pads for ESP-8266 (castellated pad version) + supply capacitor.
  • ESP-8266 pads can also be used for HopeRF products, or high power LEDs (with limited duty cycle)
  • Pads for four SOT-89 devices
  • Five mounting holes, all of which are connected to ground
  • Ample traditional through-hole prototyping space
* - MSOP-12 with 0.5mm pitch available on Rev. C and later boards only.

Revision History

  • Rev. C: (Coming soon) Added 0.5mm pitch MSOP-12 or WSON-12 (with exposed pad) footprint on bottom
  • Rev. B: (Currently shipping) Extended MSOP pads to support DFN package. Fixed issues with SSOP connections. Added another mounting hole. Fixed silkscreen
  • Rev. A: Added silkscreen, corrected through-hole area, many other fixes. Had issues with SSOP connections
  • Rev. -: Not sold, serious defects.

Sample Project

This shows one of my projects using one of these boards which demonstrates the versatility of this prototyping board. Actual assembly of the hardware went very quickly - almost negligible compared to the time spend writing the software. With all these devices, there's still plenty of room left on the board - I could have added another '2812 LED, and several more IC's in (T)SSOP, SOIC, or DIP. Note the TCS34723 in DFN package soldered right onto the board - the Vcc and Gnd pins are just the right spacing to be bridged with a 0603 ceramic capacitor.

Arduino Pro Mini project board - AZP-1A

$4.25

This project board allows you to easily use surface mount parts in your Arduino projects with easy options for mounting an Arduino Pro Mini or other Arduino compatible microcontrollers. This board provides pads for the most popular surface mount packages, broken out to rows of 0.1" pin header for ease of connection. Each pin goes to two or three holes, so making multiple connections to a pin is easy. At the top, a row of 8 pads that can take either an SOT-23-6 part (such as the MAX1555 LiPo charger IC, or some small EEPROMs), or the 5050 package commonly used for RGB-LEDs, including the WS2812/B. On the back of the board, these pins go to pads for three SOIC-16 packages (you can put two SOIC-8's next to each other as well). To the right of that are two banks of pads for SOT-23 MOSFETs. Each bank of 4 FETs is connected to a common source, and pads are provided for a resistor between source and gate. A barral jack, and optionally voltage regulators (in SOT-223 and SOIC-23-5 package) can be added to supply power.

The popular ESP8266 WiFi module is supported. These pads are for the Wi-07 and Wi-12 package, (from Electrodragon and others), and pads are provided for a 1210 capacitor across the power supply, which may be necessary for reliable operation. These same pads are the same spacing as used in the HopeRF RF transciever modules and many others, as well as that used in many inexpensive 1W RGB/RGBW LEDs. While the LED would rapidly overheat at full power, this might be useful at a lower duty cycle, or for brief flashes. In this case, the SOT-89 pads on the underside can be used for AMC7135 current regulators for the LEDs.

Features

  • Three ways to mount a microcontroller
    • Arduino Pro Mini (either original, or the one with the A4-A7 pins and ICSP pins at the end) using pin header.
    • ATmega328p, 1284p or other MCU in DIP package in throughhole area
    • In surface mount package in appropriate SMT prototyping area
  • Row of 8 SOT-23-6/5050 pads on front, 3 SOIC16 pads on back
  • Two sets of pads for 4 SOT-23 MOSFET w/pads for resistor between gate and source
  • Two rows of 8 pins in 0.1", 2mm, and 0.05" pitch
  • Set of 2 SOIC24W/N and one MSOP-12 (0.65mm pitch on front, 0.5mm on back*) or DFN-12 pads on front, two SSOP-28 on back
  • MSOP-12 (0.5mm)* has exposed pad, for use with WSON-12 packages (note that there is not enough copper around this pad to function as a heatsink - so an external heatsink may be necessary depending on part and operating conditions)
  • Multiple smaller SOIC or SSOP parts can be placed in one of the larger footprints
  • Four wire signal bus runs the length of this section - ideal for working with multiple I2C or SPI devices
  • Power supply section with holes for barrel jack (center positive)
  • Pads for three voltage regulators in standard pinouts (two TO-223, one SOT-23-5) and associated caps
  • Exposed, uncommitted GND and Vcc traces for easy power and ground wiring
  • Pads for ESP-8266 (castellated pad version) + supply capacitor.
  • ESP-8266 pads can also be used for HopeRF products, or high power LEDs (with limited duty cycle)
  • Pads for four SOT-89 devices
  • Five mounting holes, all of which are connected to ground
  • Ample traditional through-hole prototyping space
* - MSOP-12 with 0.5mm pitch available on Rev. B and later boards only.

Direct mounting of Pro Mini

Although (unfortunately) there aren't Arduino Pro Mini clones available with castellated pads, with care, it is possible to solder a pro mini directly onto the protoboard.

Revision History

  • Rev. B: (Currently shipping) Added 0.5mm pitch MSOP-12 or WSON-12 (with exposed pad) footprint on bottom
  • Rev. A: Extended MSOP pads to support DFN package. Fixed issues with SSOP connections. Added another mounting hole. Fixed silkscreen
  • Rev. -: (not sold) Similar to Rev. A, but had issues with SSOP connections.

1"x2" prototyping board

$1

Features

  • 1.05" by 1.95" actual size
  • Mounting holes on 1.7" by 0.8" centers
  • Exposed ground trace on perimiter
  • 46 groups of 3 pins in 2 rows of 14 and one of 18

2x4" Project boards - AZP-8

$2.75

SMD-centric - AZP-8C

This general purpose project board combines groups of through-hole pins (in rows of 2 and 3, with exposed copper between them) with exposed ground and distributed Vcc traces with the most popular surface mount footprints, broken out to through-holes. Holes for a center positive power supply barrel jack are provided (or wires can be soldered onto the holes), connected to pads for a SOT-223 regulator. The Vcc trace is not committed, and could be connected to Vin, Vusb, or Vout (or anything else). Pads are provided for a mini-USB connector as well (I have found micro-USB connectors to provide insufficient durability.)

Features

  • Generous 2"x 4" board size
  • Row of 5 SOT-23-6/5050 pads on front, 2 SOIC16 pads on back
  • Two sets of pads for 4 SOT-23 MOSFET w/pads for resistor between gate and source
  • MSOP/DFN-12 on front (Great for TEOS light and color sensors!), MSOP-12 (0.50mm pitch) on back, 2 pins shared with SSOP-28
  • SOIC24W/N on front, SSOP-28 on back. SSOP-28 shares 2 pins with DFN-12 outline.
  • Multiple smaller SOIC or SSOP parts can be placed in one of the larger footprints.
  • Pads to mount a barrel power jack (center positive), input capacitors
  • Pads for SOT-223 regulator
  • Exposed ground trace throughout board
  • 4 grounded mounting holes in corners (#4 screw)
  • Ample through-hole prototyping space in 2 and 3 hole groups
  • Exposed pad under SOIC-24 and SSOP-28 outlines, for compatibility with parts that require that. Note that, as there is no ground plane, this will not act as an effective heatsink (which is usually the reason for the exposed pad), so additional heatsinking may be required for these parts.

Revision History (AZP-8C)

  • Rev. B: Improved silk. Added MSOP-12 (0.5mm pitch) opposite the MSOP-12 (0.65mm pitch) footprint. Added exposed pad in middle of SOIC/SSOP outline
  • Rev. A: Extended MSOP pads to support DFN package. Improved silkscreen, rearranged power section to make connections a little easier, particularly for the USB connector.

All through-hole - AZP-8

Solderless breadboard, plain, simple and well made. Not every project requires working with SMD components - and not every maker likes working with them. Whether your project simply calls for a lot of through-hole parts and passives, or you aren't equipped for soldering SMD components, this is the board for you!

Features

  • Generous 2"x 4" board size
  • All through-hole prototyping area - no wasted space on SMD outlines you won't use
  • Exposed, uncommitted ground and Vcc traces throughout board

Mostly through-hole - AZP-8A

This general purpose project board provides a large through-hole prototyping area, along with a small power supply section (featuring two regulators), and a small SMD prototyping area, with pads for 1 SOIC-16 (or 2 SOIC-8) part, or - on the other side) 2 5050 PLCC-6 LEDs or SOT-23-6 and one DFN-6. DFN-6 is attractive because there are a number of interesting sensors (mostly light sensors) that come in that package, many for which breakout boards are not available (or not available at reasonable prices).

Features

  • Generous 2"x 4" board size
  • Row of 2 SOT-23-6/5050 pads and one set of DFN-6 pads on front, 1 SOIC-16 on back
  • Pads to mount a barrel power jack (center positive), input capacitors
  • Pads for two SOT-223 regulators
  • Exposed, uncommitted ground + Vcc traces throughout board
  • 4 grounded mounting holes in corners (#4 screw)
  • Most of board dedicated to through-hole prototyping space, with pins in groups of 2, 3, and 4.

Mini-protoboard

$1.00 ~ $6.00

Sometimes you need a big piece of prototyping board, like the other products listed here. Other times, though, you only need a tiny piece of it. That's why I created these little bits of protoboard. These consist of pieces of protoboard typically smaller than 1 square inch, with rows of holes like prototyping board, and in some versions, SMD pads. The ones with SMD pads can be used like a normal breakout board, but in many cases, you can also fit some supporting components onto the breakout board.

These prototyping boards are available in a mini-pack for $1/ea, and a mega-pack for $6 which includge over 15 square inches of prototyping board in over two dozen pieces. Some specific types of prototyping board are available individually at $1/pkg depending on current inventory (see the Tindie store for current stock)

Variants

Mini Prototyping Board Package

  • 2x4x3 - Two rows of 4 groups of 3 pins
  • 2x8x2 - Two rows of 8 groups of 2 pins
  • 2x8x3 - Two rows of 8 groups of 3 pins
  • 1206/SOT23 - 6x 1206 outlines on one side, 4x SOT-23 outlines on the other, broken out to groups of 2 pins. If MOSFETs are installed on the SOT-23 pads, you can use 1206 resistors on the other side for a pulldown on the gate

Mega Prototyping Board Package V3

  • 3 Pcs 2x4x3 - Two rows of 4 groups of 3 pins
  • 2 Pcs 1x8x3 - One row of 8 groups of 3 pins
  • 3 Pcs 1x3x9 - One row of 3 groups of 9 pins (great for power rails)
  • 4 Pcs 2x8x2 - Two rows of 8 groups of 2 pins
  • Pcs 2x8x3 - Two rows of 8 groups of 3 pins
  • 2 Pcs header-converter - One row of 8 groups of 2 pins, connected to row of 2mm and 0.05" pitch holes
  • 1 Pc 3x6x2 - Three rows of 6 groups of 2 pins
  • 1 Pc 3-4-3 - One row of 8 groups of 4 pins between two rows of groups of 3 pins
  • 1 Pc 2x8x3+1x6x3 - Two rows of 8 groups of 3 pins, at right angles to one row of 6 groups of 3 pins
  • 1 Pc 2-2-3-2-2 - One row of 4 groups of 3 pins between four rows of groups of 2 pins
  • 2 Pcs 2x8x2/2 - Two rows of 8 groups of 2 pins, with two groups of 8 pins (for power and ground) in the middle - for very small projects.
  • 1 Pcs 2x6x2/2 - Two rows of 6 groups of 2 pins, with two groups of 6 pins in the middle.
  • 1 Pc RGBLED/SMD squares - two 5050 (RGB LED) or SOT23-6 outlines and 2 1206 outlines on top, 24 square pads on bottom, broken out to groups of 2 pins.
  • 1 Pc TO-263/TO-252 prototyping board (AZV-3)
  • 1 Pc SOIC/TSSOP-16 - SOIC-16 on one side, TSSOP-16 on the other, broken out to groups of 3 pins
  • 1 Pc 1"x2" prototyping board (AZP-2)
  • 1 Pcs 1206/SOT23 - 6x 1206 outlines on one side, 4x SOT-23 outlines on the other, broken out to groups of 2 pins. If MOSFETs are installed on the SOT-23 pads, you can use 1206 resistors on the other side for a pulldown on the gate

Mega SMD Prototyping Board Package

  • 1 Pc MSOP-10 - MSOP-10 (0.5mm) broken out to groups of two pins, with a ground plane
  • 2 Pcs RGBLED/SM8 - 2 SM8 outlines on one side, two 5050 (RGB LED) or SOT23-6 outlines and 2 1206 outlines on other side, broken out to groups of 2 pins.
  • 2 Pcs SOIC/TSSOP-16 - SOIC-16 on one side, TSSOP-16 on the other, broken out to groups of 3 pins
  • 2 Pcs SOIC/TSSOP-8 - SOIC-8 on one side, TSSOP-8 on the other, broken out to groups of 3 pins
  • 1 Pc 1206/MSOP-12 - 6x 1206 outlines on one side, MSOP/DFN-12 (0.65mm pitch) outline on the other, broken out to groups of 2 pins.
  • 3 Pcs 1206/SOT23 - 6x 1206 outlines on one side, 4x SOT-23 outlines on the other, broken out to groups of 2 pins. If MOSFETs are installed on the SOT-23 pads, you can use 1206 resistors on the other side for a pulldown on the gate
  • 1 Pc 6-way Switch - Outline for 6 6mm x 3 mm SMD tactile pushbuttons. One side of each switch broken out to group of two pins, while the other sides of the switches are connected together (in a typical application, this would be ground)
  • 1 Pc 1x3x8+1x6x2 - One row of 6 groups of 2 pins, at right angle to three groups of 8 pins (power rails?)

Power Handling Prototyping Board Package

  • 2 Pcs TO-263/TO-252 prototyping board (AZV-3)
  • 2 Pcs SOT-89 prototyping board
  • 1 Pc 1117 SOT-223 breakout board, with barrel jack footprint and space for capacitors.

Trace length on SOT-89 and TO-263/252 has been minimized, as many of these components are switching power supplies for which minimizing the length of connections is critical for proper functioning

ESP8266 project board - AZP-8ESP

$3.50

This is a project board for the wildly popular ESP8266 microcontroller with native wifi. This board mounts an ESP8266 in the common ESP12, ESP07 or ESP12E/F modules; these are shielded modules on castellated pads. All available GPIO pins are broken out to groups of 3 pins (for easy soldering) along the edge of the board (so you can put it on the edge of a breadboard). The left edge of the board includes a barrel jack and power supply section. An electrolytic cap can be placed across Vin, in addition to input and output caps on the regulator. Caps are offered in both SMD and TH outlines. The regulator can be either a 1117-series (placed on the top) or the In-Gnd-Out ones, on the bottom (this pinout is more common among very low dropout regulators like the AP7365-33EG, which has dropout low enough to keep 3.3v output until the very end of a LiIon battery's discharge curve) - either way, it's an SOT-223 package; soldering down an SOT-223 package is no harder than the ESP8266 (hint: solder the tab first). A reset button (3mm x 6mm momentary push button) can be added, as can a flash button to ground GPIO0 (you still need to install a pull-up resistor on this pin for normal use). The CH_PD pin is broken out to the top left corner, right next to Vcc, so you can jumper them easily - but you don't have to in case you need to make use of that pin.

Features

  • 2"x4" board area, #4/3mm mounting holes in corners
  • Use with ESP8266 in ESP-07, ESP-12, ESP-12E, ESP-12F, or compatible module
  • Two spots for 5050 LED or SOT-23-6 package on front, SOIC-16 on back
  • Pads for 4 SOT-23 parts (Back), with 6 1206 outlines on the front
  • One set of pads for an SOIC-24 (back) or TSSOP-28 (front - shares 4 pins with SOIC-16 outline)
    • Multiple smaller SOIC or SSOP parts can be placed in one of the larger footprints.
    • Large through-hole prototyping area
    • Pads to mount a barrel power jack (center positive), electrolytic cap on input
    • Pads for one SOT-223 voltage regulator with either center-Gnd (front) or center-VOut pinout (back), and associated caps in 1206 SMD or through-hole.
    • Exposed GND trace and many points to connect to Vcc, Vin, and Gnd across the whole board
    • Pads for reset and flash buttons

Minimal parts required

  • ESP8266 in ESP-12F (recommended), ESP-07, ESP-12, or ESP-12E module
  • 2-pin 0.1" pin header + jumper, or small wire jumper to connect CH_PD to ground
  • 2x 6mm x 3mm SMD switches (one for reset button, one for flash button) - available very cheaply on ebay
  • 2.1mm through-hole barrel jack + plug
  • Voltage regulator - 1117 series (like ZLDO1117) on top outline, or AP7361/AP2114/etc on bottom outline
    • Capacitors appropriate for input and output on regulator (per datasheet), in through-hole or 1206 SMD.
    • 0.1uf cap on ADC pin (optional - improves ADC stability).
    • Large electrolytic cap to filter input (optional - depends how stable your input supply is).

Revision History

Rev. B: Thickened power/gnd traces
Rev. A: Silkscreen fixes
Rev. -: initial version, not sold due to silkscreen defects.

Arduino Prototyping Shield

$3.75

This is a prototyping shield for the Arduino Uno, Mega, Duemillenove and others that use the same shield layout. This uses the same sort of prototyping space that my other protoboards do, with predominantly through-hole prototyping area, with a few SMD footprints. The shield extends beyond the top and bottom edges of the Arduino board to provide more space for making connections to the Arduino pins, but does not extend over the USB and power connectors, so that those connectors can't interfere with the placement of the shield. Holes are provided in line with those on the Arduino boards, so you can rigidly connect the shield to the Arduino if necessary (though the placement of the holes on the Arduino board of course presents some challenges).

Features

  • 3"x3" board area - extends beyond the edges of an Uno to provide more space to make connections.
  • Exposed ground traces and holes distributed throughout the board
  • 5v and 3.3v power accessible near each corner of the board, plus one uncommitted rail "AUX" which could be used for another voltage, or for Vin, etc
  • Two sets of pads for 5050 LED (incl WS2812) or SOT-23-6 package
  • One set of pads for a DFN-6, the inconvenient package used by many color sensors (shared with one of the 5050/SOT-23-6 outlines)
  • One set of pads for an SOIC-16 (front) or TSSOP-16 (back)
  • One set of pads for SOIC-8 (front), square SMD pads (back)
  • Pads for 6 1206 SMDs (front), SOT-23 (back) - the pads on top can be used for gate-source resistors for fets on the bottom
  • Pads for one SOT-223 voltage regulator
  • Large traditional DIP prototyping area
  • Markings show location of ISP header

Revision History

  • Rev. A: Minor cosmetic changes
  • Rev. -: Original version

ATtiny84 project board - AZP-84

$1.75

This is a project board for use with an ATtiny84 or 841 (or the lower memory versions thereof). In addition to the chip itself, it provides pads for a bypass capacitor (1206), ISP header, SOT-223 regulator, and caps on the power supply (1206 or 1210), and a barrel jack. The rest of the board is dedicated to a prototyping area, providing pads for a (T)SSOP-16 or SOIC-16 (or 2 SOIC-8's), a PLCC-6 (5050 LED) or SOT-23-6, and up to 6 SOT-23 MOSFETs in 2 banks with shared source per bank (pads for 1206 resistor between gate and source on bottom of board) as well as area for through-hole parts.

Now, the Tiny84 project board is also available in a through-hole friendly version, so those who aren't comfortable with through-hole soldering can use it. This has the following changes:

  • The voltage regulator outline is TO-220, 1117-series pinout. These use a different pinout from the old 7805s; unlike the AZP-85TH, there was no room to fit a spot for an 7805 regulator instead (though one can use a 7805 by bending the leads around).
  • All capacitors, input/output on regulator and 0.1uf decoupling are through hole.
  • Reset pullup resistor is through hole
  • Everything, particularly around the top left, is packed in a little tightly to make it all fit

Features

  • 2"x2" board area, #4/3mm mounting holes on 1.7" centers
  • Use SOIC ATtiny 84/44/24 or 841/441 (DIP 84/44/24 on Through-hole version)
  • One spot for 5050 LED or SOT-23-6 package
  • Two sets of pads for 3 SOT-23 MOSFET w/pads for resistor between gate and source
  • One set of pads for an SOIC-16 (front) or TSSOP-16 (back)
    • Multiple smaller SOIC or SSOP parts can be placed in one of the larger footprints.
    • Pads to mount a barrel power jack (center positive), input capacitors
    • Pads for one SOT-223 voltage regulator
    • Exposed GND traces and multiple connection points to Vcc for easy power and ground wiring
    • 9-row long traditional DIP prototyping area
    • Row of 6 pins, giving the option to install FTDI header for use with attiny841/441.
    • ISP programming header

Revision History

    Through-hole friendly:
    • Rev. -: Initial release
    SMD version (original):
    • Rev. A: Minor cosmetic changes
    • Rev. -: Initial release

ATtiny85 project board

$1.75

This is a project board for use with an ATtiny85 (or '13, '25 or '45) . This provides an outline for the ATtiny85 in either SOIC-8 or DIP-8. Each outline has its *own* 1206 bypass cap. It also provides holes for an ISP header, and pads for SOT-223 regulator and associated caps on the power supply (1206 or 1210), and a barrel jack. The rest of the board is dedicated to prototyping area, providing pads for SOT-23 MOSFETs and an (T)SSOP-16 or SOIC-16 (or 2x SOIC-8) IC, in addition to traditional through-hole prototyping space. An excellent choice for both one-off projects (like the example mentioned below) and prototyping.

Now, the popular Tiny85 project board is also available in a through-hole friendly version, so those who aren't comfortable with through-hole soldering can use it. This has the following changes:

  • The voltage regulator can be either 7805-pinout, or 1117-series pinout. These have a different pinout, so four holes are provided; use the one that matches your part (see silk screen markings)
  • All capacitors, input/output on regulator and 0.1uf decoupling are through hole. There are places for two input caps, for 7805 vs 1117.
  • Reset pullup resistor is through hole

Features

  • 2"x2" board area, #4/3mm mounting holes on 1.7" centers
  • Use either SOIC (SMD version only) or DIP ATTiny85/45/25/13
  • One spot for 5050 LED or SOT-23-6 package
  • Two sets of pads for 2 SOT-23 MOSFET w/pads for resistor between gate and source
  • One set of pads for an SOIC-16 (front) or TSSOP-16 (back)
  • Pads to mount a barrel power jack (center positive), input capacitors
  • Exposed GND and Vcc traces for easy power and ground wiring
  • 11-row long traditional DIP prototyping area
  • ISP programming header
  • Pads for one SOT-223 1117-series voltage regulator (SMD version) or TO-220 7805 or 1117 series (Through-hole version)
  • Pads associated input/output caps

Revision History

Through-hole friendly:
  • Rev. -: Initial release
SMD version (original):
  • Rev. A: Corrected missing bypass cap for SMD package, cleaned up ground.
  • Rev. -: Sold only on clearance, did not work with SMD package without dead-bugging an extra bypass cap across it.

In the adjacent picture, you can see an example of what a finished project using this project board might look like. Note that this is a pre-production version (Rev. -).

That board is connected to a 433mhz RF receiver (just off the side of the frame), LDR light sensor and a proximity/touch sensor (the three-pin connector). One of the MOSFET channels is used to drive a pair of 10v 3W LED panels off the 12V input (using that large power resistor as ballast), controlled by the touch switch - this is used for under-shelf lighting. Meanwhile, an AOZ1282 buck converter generates 4.5v to power a red power LED (rated 5W, but run well below that) - this red led is triggered by an RF signal sent by a sensor on my door - if the LDR says it's dark in the room, the red light will light the way back to my bed (red light is least disruptive to sleep).